ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,327, issued on Aug. 12, was assigned to DR. ING. H.C. F. PORSCHE AG (Stuttgart, Germany). "Electric machine for an electric vehicle" was in... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,385,969, issued on Aug. 12, was assigned to LAPIS Technology Co. Ltd. (Yokohama, Japan). "Semiconductor device and semiconductor device testing... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,385,690, issued on Aug. 12, was assigned to Whirlpool Corp. (Benton Harbor, Mich.). "Feature for accelerating evacuation of a vacuum insulated ... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,386,124, issued on Aug. 12, was assigned to Mellanox Technologies Ltd. (Yokneam, Israel). "Device for holding a plurality of ferrules against a... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,389, issued on Aug. 12, was assigned to GoPro Inc. (San Mateo, Calif.). "Systems and methods for simulating multiple lenses" was invented b... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,389,682, issued on Aug. 12, was assigned to WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY Co. LTD. (Hubei, China). "Display... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. D1,088,278, issued on Aug. 12. "Scaffolding system" was invented by Philip Susi (West Babylon, N.Y.). The patent was filed on Jan. 17, 2024, unde... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,015, issued on Aug. 12, was assigned to GLOBALFOUNDRIES U.S. Inc. (Malta, N.Y.). "E-fuse with metal fill" was invented by Shesh M. Pandey (... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,386,713, issued on Aug. 12, was assigned to DELL PRODUCTS LP (Round Rock, Texas). "Managing use of a shared virtual disk for accessing data in ... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,386,768, issued on Aug. 12, was assigned to Intel Corp. (Santa Clara, Calif.). "Extending multichip package link off package" was invented by D... Read More